Package Substrate Research

Giving Opportunities Herbert Wertheim College of Engineering Fund 024683
Fund Purpose
Support research in the area of Package Substrate Using Metaconductor Stripline Designed for 112Gbps Applications.
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Other Herbert Wertheim College of Engineering Giving Opportunities

Giving Opportunity

Robert Thieke Professorship in Civil and Coastal Engineering

Giving Opportunity

Dean Wayne H. Chen Faculty Excellence Award

Giving Opportunity

Harold Mills Hawkins Endowed Scholarship