Package Substrate Research
Fund Purpose
Support research in the area of Package Substrate Using Metaconductor Stripline Designed for 112Gbps Applications.
Support research in the area of Package Substrate Using Metaconductor Stripline Designed for 112Gbps Applications.
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Other Herbert Wertheim College of Engineering Giving Opportunities
Giving Opportunity
Robert T. DeHoff Professorship
Giving Opportunity
Cyber-Physical Sensor Attack Security
Giving Opportunity
Sylvia T. McKenney Scholarship/Fellowship Fund