Package Substrate Research

Giving Opportunities Herbert Wertheim College of Engineering Fund 024683
Fund Purpose
Support research in the area of Package Substrate Using Metaconductor Stripline Designed for 112Gbps Applications.
Give Now to this Fund
Please select an amount
Complete My Gift

Other Herbert Wertheim College of Engineering Giving Opportunities

Giving Opportunity

Interdisciplinary Microsystems Group (IMG)

Giving Opportunity

Microfabricated Magnetic Materials

Giving Opportunity

Ford Research Support Fund