Package Substrate Research
Fund Purpose
Support research in the area of Package Substrate Using Metaconductor Stripline Designed for 112Gbps Applications.
Support research in the area of Package Substrate Using Metaconductor Stripline Designed for 112Gbps Applications.
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ESSIE Undergraduate Scholars Fund
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Rhines Rising Star Faculty Development Funds for Materials Science & Engineering
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Irene and Marshall Logan Jr. Faculty Fellow