Package Substrate Research

Giving Opportunities Herbert Wertheim College of Engineering Fund 024683

Support research in the area of Package Substrate Using Metaconductor Stripline Designed for 112Gbps Applications.

Share this Fund
Give Now to this Fund
Please select an amount
Complete My Gift

Other Herbert Wertheim College of Engineering Giving Opportunities

Giving Opportunity

Wertheim Marketing and PR Fund

Giving Opportunity

Guelph Hydrogeology Research Fund

Giving Opportunity

Kenneth G. Courage Scholarship